It is a game changer for inventors, entrepreneurs, and those working hard to get a product to market. Delivering a significantly smaller die size with reduced power needs, the Intel® Edison development board empowers the next generation of small devices—including wearables, robotics, and IoT—all on a module the size of a stamp.
- Uses a 22nm Intel® SoC that includes a dual core, dual threaded Intel® Atom™ CPU at 500MHz and a 32-bit Intel® Quark™ microcontroller at 100 MHz. It supports 40 GPIOs and includes 1GB LPDDR3, 4 GB EMMC, and dual-band WiFi and BTLE on a module slightly larger than a postage stamp.
- The Intel Edison module will initially support development with Arduino* and C/C++, followed by Node.JS, Python, RTOS, and Visual Programming support in the near future.
- The Intel Edison module includes a device-to-device and device-to-cloud connectivity framework to enable cross-device communication and a cloud-based, multi-tenant, time-series analytics service.
The Intel® Edison development
platform is designed to lower the
barriers to entry for a range of
inventors, entrepreneurs, and
consumer product designers to
rapidly prototype and produce
“Internet of Things” (IoT) and
wearable computing products.
Intel® Edison Board for Arduino*
Supports Arduino Sketch, Linux,
Wi-Fi, and Bluetooth.
Board I/O: Compatible with
Arduino Uno (except 4 PWM
instead of 6 PWM):
• 20 digital input/output pins,
including 4 pins as PWM
• 6 analog inputs.
• 1 UART (Rx/Tx).
• 1 I2C.
• 1 ICSP 6-pin header (SPI).
• Micro USB device connector OR
(via mechanical switch)
dedicated standard size USB
host Type-A connector.
• Micro USB device (connected to
• SD card connector.
• DC power jack (7 to15 VDC
Intel® Edison Breakout Board
Slightly larger than the
Intel® Edison module, the
Intel® Edison Breakout Board has
a minimal set of features:
• Exposes native 1.8 V I/O of the
• 0.1 inch grid I/O array of
through-hole solder points.
• USB OTG with USB Micro
• USB OTG power switch.
• Battery charger.
• USB to device UART bridge with
USB micro Type-B connector.
• DC power supply jack (7 to
15 VDC input).
Intel® IoT Analytics Platform
• Provides seamless Device-toDevice
• Ability to run rules on your data
stream that trigger alerts based
on advanced analytics.
• Foundational tools for
collecting, storing, and
processing data in the cloud.
• Free for limited and
Form factor Board with 70-pin connector
Dimensions 35.5 × 25.0 × 3.9 mm (1.4 × 1.0 × 0.15 inches) max
C/M/F Blue PCB with shields / No enclosure
Connector Hirose DF40 Series (1.5, 2.0, or 3.0 mm stack height)
Operating temperature 32 to 104°F (0 to 40°C)
Total of 40 GPIOs, which can be configured as:
SD card 1 interface
UART 2 controllers (1 full flow control, 1 Rx/Tx)
I2C 2 controllers
SPI 1 controller with 2 chip selects
I2S 1 controller
GPIO Additional 12 (with 4 capable of PWM)
USB 2.0 1 OTG controller
Clock output 32 kHz, 19.2 MHz
MAJOR EDISON COMPONENTS
SoC 22 nm Intel® SoC that includes a dual-core, dual-threaded Intel® Atom™ CPU at 500 MHz and a 32-bit
Intel® Quark™ microcontroller at 100 MHz
RAM 1 GB LPDDR3 POP memory
(2 channel 32bits @ 800MT/sec)
Flash storage 4 GB eMMC (v4.51 spec)
WiFi Broadcom* 43340 802.11 a/b/g/n;
Dual-band (2.4 and 5 GHz)
Onboard antenna or external antenna (SKU configurations)
Bluetooth Bluetooth 4.0
Input 3.3 to 4.5 V
Output 100 ma @3.3 V and 100 ma @ 1.8 V
Power Standby (No radios): 13 mW
Standby (Bluetooth 4.0): 21.5 mW (BTLE in Q4-14)
Standby (Wi-Fi): 35 mW
FIRMWARE + SOFTWARE
CPU OS Yocto Linux* v1.6
Development environments Arduino* IDE
Eclipse supporting: C, C++, and Python
Intel XDK supporting: Node.JS and HTML5
MCU OS RTOS
Development environments MCU SDK and IDE